Weiliang Will Zeng, Ph.D.

450 


Sr Staff System Engineer
Qualcomm AI Research
San Diego, CA

Weiliang Will Zeng is with Qualcomm AI Research, San Diego, CA, where he is now a Sr Staff System Engineer. He received his Ph.D. degree from Department of Electronic Engineering, Tsinghua University, Beijing, China, in 2012 and his B.S. degree in electronic engineering from the University of Electronic Sciences and Technology of China (UESTC), Chengdu, China, in 2007, both with the highest honor. He was a Research Scholar (2009-2011) and a Post-Doctoral Fellow (2013-2014) at Missouri University of Science and Technology (formerly University of Missouri, Rolla, MO). His research interests include machine learning, optimization, wireless communications, information theory, signal processing, as well as for emerging technologies.

He was the recipient of QualStar(s) from Qualcomm Incorporated, the scholarship award for Excellent Doctoral Student from Ministry of Education of China, Distinguished Honor Graduate from Beijing Municipal Commission of Education, and also the First-Class Scholarship for graduate students from Tsinghua University. He is a frequent author and reviewer for IEEE journals/conferences, TPC Co-chair for IEEE Globecom’17, and TPC members for various IEEE flagship conferences.

At Qualcomm, Dr. Zeng works on aggressive research programs to enable the intelligent edge that serves billions of users using an unprecedented multidisciplinary approach coordinating novel technology developed in machine learning, information theory, signal processing, and wireless communications.

Research Interest

  • Machine learning

  • Modeling, analysis, design, and optimization

  • Wireless communications, information theory, and signal processing

Professional Appointments

Sr Staff System Engineer, Qualcomm AI Research (since Dec. 2014), San Diego, CA, US

  • AI Research: contribute to enabling the intelligent edge that serves billions of users

    • Design state-of-the-art artificial intelligence algorithms to make the intelligent edge become smaller, run faster, consume less power, and be able to learn continuously in the real world

  • 5G+AI: contribute to the establishment of the first ML for wireless project in Qualcomm

    • Enabling AI to improve the performance of the world's most advanced wireless systems

    • Cutting-edge research and development that influences the design and architecture for wireless technology

    • Invented 5G+AI algorithm commercialized in Qualcomm product defining the next-generation

  • AI-enabled air interface

    • LTE/5G and beyond: contribute to the global leading position of wireless research and development in Qualcomm

    • Diverse experience in cutting-edge research, innovative algorithms, link-level study, fixed-point design, standards, patent contributions, and prototypingproductcommercialization

    • One of the key system contributors to Qualcomm’s CoMP Spectrum Sharing technology, showcased at MWC’18 and MWC’19 and highlighted as one of the technologies for unlocking the full potential of 5G

Post Doctoral Fellow, Dept. of Electrical and Computer Engineering (Feb. 2013 to Dec. 2014), Missouri University of Science and Technology, Rolla, MO, US

  • Adviser: Prof. Chengshan Xiao

  • Research Topic: Transceiver design for multiple antennas, MIMO-OFDM, 4G LTE, cognitive radio, and energy harvesting networks

Research Scholar, Dept. of Electrical and Computer Engineering (Aug. 2009 to Aug. 2011), Missouri University of Science and Technology, Rolla, MO, US

  • Adviser: Prof. Chengshan Xiao

  • Research Topic: Adaptive transmission for practical systems with finite-alphabet inputs; capacity analysis; precoding for MIMO systems; practical design for MIMO-OFDM systems

  • Achievement: Invented algorithms provide significant performance gain for practical MIMO systems and are successfully implemented for technical field trials.

Education

Ph.D., Dept. of Electronic Engineering (Sep. 2007 to Dec. 2012), Tsinghua University, Beijing, China

  • Adviser: Prof. Jianhua Lu

  • Graduated with the highest honor; GPA: 88/100

  • Thesis: Precoded Modulation for Wideband Wireless Communications

  • Achievement: Published 6 IEEE Journal papers and 10 IEEE Conference papers; held 4 patents.

B.S., Electronic Engineering (Sep. 2003 to Jul. 2007), University of Electronic Science and Technology of China, Chengdu, China

  • Graduated with the highest honor; GPA: 3.8/4.0

  • Ranking: top 0.2%; granted admission to Tsinghua University for Ph.D. study without national standardized test

  • Thesis: Algorithm design, performance analysis, and hardware implementation for phase lock loop systems